TPS552892-Q1: .

Want to ask, the current use of the environment is the input voltage 9-16V output voltage 12V output current 5A. The package of this chip is relatively small, and the grounding pad is relatively small, and the heat dissipation environment of the chip itself will be relatively poor. There is no recommended external heat dissipation method in the chip specification book. I would like to ask if there is any recommended heat dissipation method under the current heating condition. The heat dissipation simulation result given by our heat dissipation engineer is that the chip surface temperature is 96°. Will it affect the normal use or life of the chip?

Lydia：

Hi，

You can refer to page 5 “6.3 Recommended Operating Conditions”& page 6 “6.4 Thermal Information” of the datasheet for the recommended conditions of use, and it is recommended to use the chip within the recommended range. www.ti.com/…/tps552892-q1.pdf

There are several places in the datasheet that describe the heat dissipation recommendations, so please refer to them ，page 20 “8.1 Application Information” and page 28 “8.4.1 Layout Guidelines”

,

gou zi：

The heat dissipation method written in the specification can not solve the thermal power consumption generated by 60W. We have also used this chip before, but only to output 2A, in our later test 2.5A will have obvious heat, to force external heat dissipation measures. There are better cooling solutions for this situation

,

Lydia：

There is not much introduction in the datasheet about the external heat dissipation method, but there are some customer experiences that can be shared with you, some customers have used a heatsink for heat dissipation, and some customers have considered thermal connected the top part of the device to their metal housing for cooling, but we have not conducted relevant tests, you can see if these two methods can be referenced.