TI中文支持网Part Number:TDA4VH-Q1
你好！我想知道对TDA4芯片贴片的炉温曲线的建议和本体温度的要求，我在PNAS 的 SPEC里并没有看到，希望提供一下，谢谢！
Hello! I would like to know the recommendations for SMT reflow profile and body temperature requirements for TDA4 chip placement, I don't see it in the PNAS SPEC, would like to provide it, thanks!
Shine：
请参考下面的帖子。https://e2echina.ti.com/support/processors/f/processors-forum/286151/tda4vm-q1-reflowhttps://e2e.ti.com/support/processors-group/processors/f/processors-forum/1216085/tda3ma-tda3marbabfrq1-soldering-reflow-profile-peak-temperature/4590065
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cao qi：
I've been looking in the above link for a long time and still can't find the TDA4 furnace temperature profile requirements, please help!
以上链接找了很久，仍未找到TDA4炉温曲线要求，请帮忙
,
Shine：
我们只提供一个通用的reflow profile，参考上面的文档Figure 3. TI Representation of the J-STD-020 Classification Profile (not to scale)，具体的回流焊曲线需要客户自己按照文档来做。
TI’s packages are designed to meet JEDEC standard requirements for reflow. This package is rated as MSL3 at peak reflow temperature 250C. TI does not have a custom reflow profile for the device. We recommend that the customer follow a reflow profile that meets the JEDEC standard.
http://www.ti.com/lit/an/spraby1/spraby1.pdf
