Part Number:SN74LVC1G126
Our QC found the X-ray is different, can you help?
And I asked a professionals said because the sealing and testing plant is different, is this explanation correct?
Hope your soon reply, Tks!!!
Kailyn Chen:
您好,我看到您的问题也已经在英文E2E上咨询美国工程师了,工程师已给您回复,说这两款的顶端标识不同,代表了是不同的封装地。
e2e.ti.com/…/sn74lvc1g32dckr-x-ray-difference
另外,在产品的可靠性主页,有关于X-RAY的介绍信息:
https://www.ti.com/support-quality/reliability/reliability-home.html
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Renee Chang:
Thank you so much!!!!
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Renee Chang:
our clients said,they cannot see any explanation on the x-ray wafer bonding difference. Please check with TI if they update the wafer version in these two different dates or sites?
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Renee Chang:
our clients said,they cannot see any explanation on the x-ray wafer bonding difference. Please check with TI if they update the wafer version in these two different dates or sites?
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Kailyn Chen:
Hello,sorry to reply you late.
OK, I would confirm with this question.
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Kailyn Chen:
Hello, Our foreign engineer has replied to you about your questions, and if you have another question, you could post it directly, any other questions, please feel free to contact me again.
(+) SN74LVC1G32DCKR x-ray difference – Logic forum – Logic – TI E2E support forums
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Kailyn Chen:
I am sorry the link has something problem which couldn't click, now I attached again:
e2e.ti.com/…/sn74lvc1g32dckr-x-ray-difference
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Kailyn Chen:
I am so sorry that the hyperlink has some problem, so I attached it with .txt.
X ray difference.txt
I am sorry the link has something problem which couldn't click, now I attached again: https://e2e.ti.com/support/logic-group/logic/f/logic-forum/1016613/sn74lvc1g32dckr-x-ray-difference
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Chunjiang Wu:
这明显不是同一个晶圆嘛