LMZ14201: Request FA for Order number：T02156486 MPN: LMZ14201TZX-ADJ/NOPB 1500pcs

Order Number：T02156486 MPN: LMZ14201TZX-ADJ/NOPB QTY 1500pcs DC:2138*1+2140*2 Order Time：28/12/2021

We found that there is failure on ICT test on MPN: LMZ14201TZX-ADJ/NOPB. Kindly help to provide the RMA# to send 3pcs failure part for FA. Below is the detail.

• Failure: VCC power Test failed for 3v3.
• D/C: 2138
• Reject rate : 17/31 board fail (54.8%) failure

  

Johnsin Tao：

Hi

    能够给出更详细的信息：哪个脚阻抗异常（正常是多少？  异常是多少？）  有没有确认ICT的ESD?

    其次你们芯片哪里买的？直接购买自TI, 还是代理商？

,

Auttawoot Prommas：

buy from TI online order # T02156486

,

Johnsin Tao：

Hi   

       这些信息有吗？

       能够给出更详细的信息：哪个脚阻抗异常（正常是多少？  异常是多少？）  有没有确认ICT的ESD?

,

Auttawoot Prommas：

Dear , we would like to provide more analysis report as attached file .

,

Auttawoot Prommas：

We have do cross section analysis and found problem as pictures, could you advise ?

We have some questions below 

 Questons

1.These are cross section images at the Si die which showcase the preliminary findings on bad versus good components , pls help to review and do have suggestion on cross sectio report

2. Another concern we having here are which we found the failure unit look like the part is not filled up with mold compound , is the part is fully moulded or not f

ully moulded . I believe that if the molding been full covered , the solder will unable to flow and short the dies pad . 

,

Auttawoot Prommas：

TEB_Reflow Profile_before.pdfTEB_TOP_1300_28022022_after.pdfsnaa214b.pdf

We do adjust reflow to lower temp follow TI suggestion document but the issue still found .

,

Auttawoot Prommas：

TEB- U1 defective report (1).pptx

Some updated problem report

,

Johnsin Tao：

Hi

    我们内部的分析我们没法做的，我们主要针对芯片外围应用的技术支持。