DP83867IR: DP83867 PHY VQFN package maximum pressure specification

Dear Sir,

How about DP83867 PHY VQFN package maximum pressure specification?

The maximum pressure is normal to package and uniform distribution which can not damage package and solder ball.

Our application will be put thermal interface material between DP83867 and metal housing to conduct heat to metal part. Since thermal interface material will be compressed, so pressure will also applied on DP83867 package.

Roger

Kailyn Chen：

您好，您的意思是想加散热器在DP８３８６７上，想确认下DP８３８６７的能够承受的压力规格是吗？暂时没有这个方面的参数可以参考呢。

不知是不是误解了您的意思。