tps61030按照官方设计的PCB,只是PowerPAD简单接GND,没有大块覆锡。通电测试一会就坏掉了,VBAT管脚对地短路。不知何故?是芯片有问题吗?
Jasper Li:
去掉电感确定是bat还是SW损坏, 我猜测是SW损坏了。这款IC对布板和稳定性要求比较高,否则容易导致SW尖峰电压过高。可能使用缓冲电路解决这个问题,缓冲电路设计方法如下
http://www.ti.com/lit/an/slva255/slva255.pdf
Coffee Ge73:
如Jasper所说,可以将芯片或器件取下来先确定一下损坏的引脚;此外,在没有敷铜的情况下,建议轻载下工作,防止芯片热击穿
lin LEE1:
建议先看看资料
The LM3489 is a high efficiency PFET switching regulator controller that can be used to quickly and easily develop a small, cost effective, switching buck regulator for a wide range of applications. The hysteretic control architecture provides for simple design without any control loop stability concerns using a wide variety of external components. The PFET architecture also allows for low component count as well as ultra-low dropout, 100% duty cycle operation. Another benefit is high efficiency operation at light loads without an increase in output ripple. A dedicated Enable Pin provides a shutdown mode drawing only 7µA. Leaving the Enable Pin unconnected defaults to on.Current limit protection can be implemented by measuring the voltage across the PFET’s RDS(ON), thus eliminating the need for a sense resistor. A sense resistor may be used to improve current limit accuracy if desired. The cycle-by-cycle current limit can be adjusted with a single resistor, ensuring safe operation over a range of output currents.
http://www.ti.com.cn/product/cn/lm3489
lin LEE1:
回复 lin LEE1:
不好意思 内容回复错了。。。。 PowerPAD一方面是接地,另一方面主要是散热。不做好散热,很容易烧芯片。VBAT和地短了说明芯片烧坏了。可以考虑用TI官方的封装。
tao smith:
回复 lin LEE1:
Hi
layout的时候,还要重点注意的功率路径,这个一般可以参考EVM板。
Max Han:
在烧坏前有用点温计测过芯片的表面温度吗
Silin Dong:
回复 Max Han:
没有,就是很烫手
Silin Dong:
回复 lin LEE1:
还有就是芯片正常工作是部分引脚摸不得,一摸就异常了,直流电源的电压示数一下就降下来了!
ming li4:
回复 Silin Dong:
PowerPAD接GND一定要大面积铺铜,来加大散热。
lin LEE1:
回复 ming li4:
PowerPAD一方面是接地,另一方面主要是散热。不做好散热,很容易烧芯片。VBAT和地短了说明芯片烧坏了。可以考虑用TI官方的封装。