TI型号中E4,G4到底有什么含义？

TI专家好，

TI型号中E4,G4到底有什么含义？比如TL062CDE4,TL062CDG4有什么区别呢？

谢谢！

Carter Liu：

请参考这里：

http://focus.ti.com/quality/docs/gencontent.tsp?templateId=5909&navigationId=11753&contentId=5055

Carter Liu：

注意看这里：

:Beginning June 1, 2004, TI will change the "e" in the Pb-free finish category to a "G" when a TI device/package combination converts to a "Green" mold compound. For example, a TI device built with NiPdAu finish will have a Pb-free finish category of "e4" until a green mold compound is implemented. When implemented, the Pb-Free finish category will be changed to "G4". (Replacement of the "e" with a "G" in the Pb-Free finish category is not part of the J-STD-609 standard at this time, but will be implemented for TI products.) "G3" category is "E3" matte tin (Sn) Pb-free finish with "Green" mold compound

即2014年6月1号之后G4就是之前的E4，名字变了，芯片本身并没有什么变化

Jerry Xiao：

e4：管脚镀层 NiPdAu,NiPd,Au,Ag(Pb-Free+250C/260C MSL)

G4：管脚镀层 NiPdAu,NiPd, Au,Ag (sameas e4 + Green Mold Compound)